科翔股份:高阶HDI领域 公司已掌握16层任意层互联技术

GateNews

金十数据8月28日讯,科翔股份在互动平台表示,高阶HDI领域,公司已掌握16层任意层互联技术、30-45μm超薄PP压合技术,目前已实现激光盲孔直径75±10μm、X孔75-100μm,线宽线距50/50μm,盲孔电镀纵横比0.8:1,盲孔对准度50μm等技术。公司还将持续加大HDI产品的研发投入,提升制造能力,匹配最新技术发展对PCB产品的需求。

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